Toshiba, manufacturer of the ever-controversial PlayStation 3 chips Cell and RSX, plan to create the graphics processing RSX at a 65nm process next month according to Nikkei.
The chip has been manufactured at a 90nm process since before the PS3's launch last November. The smaller die size of the chip will equate to less system heat, leading to less fan noise, creating a more reliable PS3. In addition, it should help cut hardware costs for Sony, which will eventually lead to cheaper prices for the consumer.
The Cell is currently created at a 65nm process, a smaller size than the 90nm seen at launch. It is generally believed that the switch in size allowed Sony to price the 40GB SKU at USD 399.
Unsurprisingly, Nikkei also reports that Sony will reduce the processes for PS3 chips to 45nm in either Q3 or Q4 of the 2008 fiscal year, once again benefiting both the company and the consumer.

It sounds good, let Sony make better ps3 less noise and heats. Because my ps3 gives lots of heats and noise sometimes when i play over 3 hours.
Oh nice, price cuts i see! :D
lol it might not make a hole big diffrence to the average gamer but there r a few negatives to moving to a 65 then a 45. cheaper yes but it actually will take off a little bit of power and a small bit of how far u can push the graphics. wont let anything more then what u have in ratchet and clank. even though that game is great they could probaly push it alot further with details if they would leave it at 90.
It would be nice if the next batch of 80GBs would have these reduced die sizes,becuz as far as i've heard,only 40gb has the 65nm Cell.
This is great because my ps3 can get really loud at times, it makes me feel soory fro 360 owners who have to put up with that sound constantly. I doubt they will drop the price any more, Sony are already losing enough money as it is.
i dont need the heat, its even hot in the summer in florida
@ lurkingshadow89: where are u getting those statements from???
@ leeman99: LOL
45 nm is less powerfull than 90nm..................by using less power. Thats it, it uses less power. The chip is still the same chip, it still has the same performance, maybe even better as it doesnt run as hot for the speed they are running it at. They could actually overclock it much better now with a smaller die...but they wont. Bottom line, die shrink is good for both Sony and us.
psn id: gingo... well this is good for sony but wont make much difference to the gamers but i suppose its an advancement
Interesting news, but? Like who cares? PSU, please get the proper news. XD
Doesn't really mean a damn thing to any of us.
home beta anyone
There is an effect on performance and its positive. Going from 90nm to 65nm means a few things:
A wafer of 300mm can hold more 65nm CPU's / GPU's then it can 90nm ones. More CPU's / GPU's can be fitted on a wafer - hence they can make more Processors in each batch - hence the cost is lower to produce each CPU / GPU.
The reduction in die size also greatly reduces the distance between each of the transisters hence it reduces the amount of power (electricity) required - hence the amount of heat generated is proportionately less - hence the CPU is more reliable and can maintain its maximum performance without degridation (IE: maintain 3.2GHz without stepping down).
When the Cell processor was announced 6 years ago it was quite an amazing processor compared to the IBM PPC G3 and early G4 PPC CPU's. However 90nm is not very "impressive" technologically speaking today, infact 65nm process isnt state of the art either. Intel already produces Quad cores at 45nm today.
These new CPU's are not only smaller & cooler but are vastly more powerful than the Cell CPU - because each Intel Quad Core CPU contains more than 800 million transisters (Cell has only 250 million in total). The new Quads contain 12MB of L2 cache whereas the Cell only contain a 512K L2 cache.
Similarly IBM has moved on from Cell and has gone on to build the PPC Power6 platform on 65nm for its P & Z class systems with 790 million transisters with Quad cores each running at 5GHz (apparently can go to 6GHz) and with 4MB of L2 cache per Core (total 16MB) and support for L3 32MB cache. IBM will be trying to play catch up with Intel and will need to move to 45nm in its next itteration.